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High Thermal Conductive Metal Clad Laminate
| ♣ FR-HTL1000 |
特點
- High heat dissipation
- Good circuit workability
- Excellent thermal durability
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應用
- LED,PDP,Regulator for TV LED light
- inverter & converter
- lgniter, voltage regulator
- Rectifier , Power supply
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| ♣ FR-HTL2000 |
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應用
- LED,3D LED ,Regulator for TV Module
- Personal computer. notebook computer
- Cellular phone ,A/V device etc
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| -- 型式 -- |
| ♣ FR-HTL1000 |
♣ FR-HTL2000 |
| copper foil |
circuit layer
(0.5~3 oz) |
| |
| Epoxy + Ceramic Filler |
Dielectric layer
(100um) |
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Substrate
(0.3~3.0mm) |
| Metal Plate(AL base, copper) |
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| copper foil |
circuit layer
(0.5~3 oz) |
| |
| Epoxy + Ceramic Filler |
Dielectric layer
(100um) |
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| -- 測試 -- |
| Test Item |
Unit |
Test Condition |
FR-HTL1000
FR-HTL2000 |
| Flammability |
. |
UL94 |
v-0 |
| solder Float ( 288 C) |
min |
A |
above 10 |
| solder Float ( 260 C) |
min |
A |
above 30 |
| Peel Strength (1 oz Cu) |
kgf/cm |
A |
3.5 |
| Thermal Conductivity) |
W/mk |
A |
2.0 |
| Dielectric Breakdown voltage |
Ac kV |
A |
above 3.0 |
| Comparative Tracking index |
volt |
IEC Method |
600.0 |
| Dielectrc Constant |
|
1MHz |
6.0 |
| 1GHZ |
5.6 |
| Dissipation Factor |
|
1MHz |
0.014 |
| 1GHZ |
0.016 |
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