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視覺檢測工控電腦 /
FR-EPC6002
 
No. FR-NU-6000
   

FR-EPC6002

簡介

6th-Gen Core™ i Skylake Platform

FR-EPC6002 features Intel® 6th-Gen Core™ desktop processor to deliver the same computing power as conventional 19” IPC. With socket-type CPU support, it allows users to flexibly select a CPU, from entry-level Celeron® to high-end Core™ i7, according to ones performance demand and budget.

Dual PCIe Slots

FR-EPC6002 offers up to two PCIe slots in its compact chassis to deliver the same level of expandability as off-the-shelf IPCs. Users can install a wide variety of I/O, communication, vision and motion cards for versatile applications.

Versatile Mounting Options

For ease of deployment and setup, FR-EPC6002 is designed with multiple mounting mechanisms. You can place it in a cabinet using wall-mounting brackets, or fix it to a DIN rail with optional DIN-mounting clip. The rack-mounting kit allows two FR-EPC6002 units installed in a rack using the same space as a 4U, 19" IPC.

Regulated Air Flow for Add-on Cards

When add-on cards are installed, it is crucial to maintain a reasonable temperature inside the chassis. FR-EPC6002 has well-designed air inlet apertures and an optional smart fan to create regulated air flow through all cards. The design effectively brings out the heat and significantly increases system reliability.

特色

  • Supports 6th-Gen Intel® Core™ i7/ i5/ i3, Pentium and Celeron® LGA1151 CPU
  • Two expansion slots – one x16 PCIe and one x8 PCIe
  • Rugged, -25 °C to 60 °C fanless operation
  • 2x GbE, 4x USB 3.0 and 5x COM ports
  • Dual DVI display outputs
  • Wall-mounted (optional DIN-rail and rack-mounting)
  • Optional fan with automatic temperature sensing and fan control

規格

TOP
System Core
Processor   Supports 6th-Gen Intel® Core™, Pentium® and Celeron® LGA1151 CPU
 Core™ i7-6700TE (8M Cache, 2.4/3.4 GHz, 35W TDP)
 Core™ i5-6500TE (6M Cache, 2.3/3.3 GHz, 35W TDP)
 Core™ i3-6100TE (4M Cache, 2.7 GHz, 35W TDP)
 Pentium® G4400TE (3M Cache, 2.4 GHz, 35W TDP)
 Celeron® G3900TE (2M Cache, 2.3 GHz, 35W TDP)
Chipset   Intel® H110 Platform Controller Hub
Graphics   Integrated Intel® HD 530/510 Controller
Memory   Up to 16 GB DDR4-2133 by one SODIMM socket
I/O Interface
Ethernet Port   1x Gigabit Ethernet port by Intel® I219-LM
 1x Gigabit Ethernet port by Intel® I210-IT
Video Port   2x DVI-D connectors for DVI outputs, supporting 1920x1200 resolution
Serial Port   2x Software-programmable RS-232/422/485 ports
 3x 3-wire RS-232 ports
USB   4x USB 3.0 ports
Audio   1x Speaker-out
Expansion Bus/ Internal I/O Interface
Remote Ctrl. & Status Output   1x 2x6-pin 2.0mm pin-header connector for remote on/off control and status LED output
PCI Express   1x PCIe x16 slot @ Gen3, 16-lanes PCIE signals
 1x PCIe x8 slot @ Gen2, 4-lanes PCIE signals
Storage Interface
SATA   1x SATA port for 2.5" HDD/SSD installation
mSATA   1x full-size mSATA socket
Power Supply
DC Input   1x 3-pin pluggable terminal block for 8~35 VDC input
Mechanical
Dimension   124 mm (W) x 225 mm (D) x 174 mm (H)
Weight   2.8 Kg
Mounting   WWall-mounting (standard)
 DIN-Rail mounting (optional)
 rack-mounting (optional)
Environmental
Operating Temperature   -25°C ~ 60°C */**
StorageTemperature   -40°C ~ 85°C
Humidity   10%~90% , non-condensing
Vibration   Operating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to IEC60068-2-64)
Shock   Operating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27)
EMC   CE/FCC Class A, according to EN 55022 & EN 55024
* The CPU loading is applied using Passmark® BurnInTest 8.0. For detail testing criteria, please contact Fadracer Technology Inc.
** For sub-zero operating temperature, a wide temperature HDD drive or Solid State Disk (SSD) is required.
TOP
Neousys, 宸曜 POC6000, POC6002, POC6032

 




 
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